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IMAGE PART NO. PRICE QUANTITY STOCK MANUFACTURE DESCRIPTION Package / Case Series Packaging Configuration Mounting Type Operating Temperature Part Status Input Factory Stock Minimum Quantity Power - Max IGBT Type Voltage - Collector Emitter Breakdown (Max) Current - Collector (Ic) (Max) Vce(on) (Max) @ Vge, Ic Current - Collector Cutoff (Max) Input Capacitance (Cies) @ Vce NTC Thermistor
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Infineon Technologies IGBT CHIP WAFER Die - Bulk   Surface Mount 175°C (TJ) Active   0 998 - Trench 600V 48A -      
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Infineon Technologies IGBT CHIP WAFER Die - Bulk   Surface Mount 175°C (TJ) Active   0 1164 - Trench 600V 35A -      
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Infineon Technologies IGBT CHIP WAFER Die - Bulk   Surface Mount 175°C (TJ) Active   0 1547 - Trench 600V 24A -      
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Infineon Technologies IGBT CHIP WAFER Die - Bulk   Surface Mount 175°C (TJ) Active   0 2804 - Trench 600V 18A -      
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Infineon Technologies IGBT CHIP WAFER Die - Bulk   Surface Mount 175°C (TJ) Active   0 3405 - Trench 600V 8A -      
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Infineon Technologies IGBT CHIP WAFER Die - Bulk   Surface Mount 175°C (TJ) Active   0 3644 - Trench 600V 8A -      
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Infineon Technologies IGBT CHIP WAFER Die - Bulk   Surface Mount 175°C (TJ) Active   0 3584 - Trench 600V 10A -      
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Infineon Technologies IGBT CHIP WAFER Die - Bulk   Surface Mount 175°C (TJ) Active   0 2042 - - 600V 30A -      
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Infineon Technologies IGBT CHIP WAFER Die - Bulk   Surface Mount 175°C (TJ) Active   0 5890 - Trench 600V 4A -      
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Infineon Technologies IGBT IFS100B12N3E4B39BOSA1 Module -   Three Phase Inverter Chassis Mount 175°C (TJ) Obsolete Standard 0 0 515W Trench Field Stop 1200V 100A 2.1V @ 15V, 100A 1mA 6.3nF @ 25V Yes
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Infineon Technologies HYBRID PACK DRIVE Module -   Three Phase Inverter Chassis Mount 175°C (TJ) Active Standard 0 6 - Trench Field Stop - 820A - - - No
FS820R08A6P2LBBPSA1
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Infineon Technologies HYBRID PACK DRIVE Module -   Three Phase Inverter Chassis Mount 175°C (TJ) Active Standard 0 6 - Trench Field Stop - 820A - - - No
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