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IMAGE PART NO. PRICE QUANTITY STOCK MANUFACTURE DESCRIPTION Type Series Packaging Sensitivity Output Type Frequency Range Shape Voltage Range Termination Part Status Current - Supply Direction Factory Stock Minimum Quantity Voltage - Rated Size / Dimension Port Location S/N Ratio Height (Max)
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InvenSense / TDK MIC MEMS DIGITAL PDM OMNI -36DB MEMS (Silicon) ICS-51360 - -36dB ±1dB @ 94dB SPL Digital, PDM 50Hz ~ 20kHz Rectangular 1.65V ~ 3.63V Solder Pads Active 730µA Omnidirectional 0 10000 1.8V 0.138" L x 0.104" W (3.50mm x 2.65mm) Bottom 62dB 0.039" (0.98mm)
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RFQ
10,000
In-stock
InvenSense / TDK MIC MEMS MULTI-MODE OMNI -38DB MEMS (Silicon) - Tape & Reel (TR) -38db ±1dB Analog 50Hz ~ 20kHz Rectangular 1.52V ~ 3.63V Solder Pads Active 190µA Omnidirectional 0 10000 - 0.138" L x 0.104" W (3.50mm x 2.65mm) Top 67dB 0.043" (1.10mm)
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RFQ
10,000
In-stock
InvenSense / TDK MIC MEMS MULTI-MODE OMNI -38DB MEMS (Silicon) - Tape & Reel (TR) -38db ±1dB Analog 50Hz ~ 20kHz Rectangular 1.52V ~ 3.63V Solder Pads Active 190µA Omnidirectional 0 10000 - 0.138" L x 0.104" W (3.50mm x 2.65mm) Bottom 67dB 0.039" (0.98mm)
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RFQ
5,000
In-stock
InvenSense / TDK MIC MEMS DIGITAL OMNI -26DB MEMS (Silicon) - Tape & Reel (TR) -26 ±1dB @ 94dB SPL Digital, TDM 50Hz ~ 20kHz Rectangular 1.62V ~ 3.63V Solder Pads Active 1.5mA Omnidirectional 0 5000 - 0.157" L x 0.118" W (4.00mm x 3.00mm) Bottom 65dB 0.043" (1.10mm)
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RFQ
10,000
In-stock
InvenSense / TDK MIC MEMS DIGITAL I2S OMNI -26DB MEMS (Silicon) - Tape & Reel (TR) -26dB ±1dB @ 94dB SPL Digital, I²S 50Hz ~ 20kHz Rectangular 1.62V ~ 3.63V Solder Pads Active 1.5mA Omnidirectional 0 5000 - 0.157" L x 0.118" W (4.00mm x 3.00mm) Bottom 65dB 0.043" (1.10mm)
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