- Package / Case :
-
- 10-UFBGA, WLCSP (2)
- 10-VFDFN Exposed Pad (2)
- 10-XFBGA, WLCSP (2)
- 12-UFDFN Exposed Pad (5)
- 14-DIP (0.300", 7.62mm) (1)
- 14-SOIC (0.154", 3.90mm Width) (5)
- 14-TSSOP (0.173", 4.40mm Width) (4)
- 16-SOIC (0.154", 3.90mm Width) (1)
- 16-TSSOP (0.173", 4.40mm Width) (3)
- 16-VFQFN Exposed Pad (1)
- 16-VQFN Exposed Pad (4)
- 20-TSSOP (0.173", 4.40mm Width) (1)
- 24-VFQFN Exposed Pad (2)
- 25-UFBGA, WLCSP (2)
- 3-XDFN (6)
- 32-UFQFN Exposed Pad (1)
- 32-VFQFN Exposed Pad (3)
- 36-VFQFN Exposed Pad (2)
- 48-VFQFN Exposed Pad (1)
- 5-UFDFN (2)
- 6-XFDFN (2)
- 64-VFQFN Dual Rows, Exposed Pad (4)
- 64-VFQFN Exposed Pad (1)
- 8-SOIC (0.154", 3.90mm Width) (11)
- 8-TSSOP (0.173", 4.40mm Width) (12)
- 8-UFDFN (2)
- 8-UFDFN Exposed Pad (8)
- 8-XFQFN Exposed Pad (1)
- Die (69)
- Packaging :
- Part Status :
- Voltage - Supply :
-
- 1.5 V ~ 1.7 V (16)
- 1.65 V ~ 3.6 V (7)
- 1.65 V ~ 5.5 V (1)
- 1.7 V ~ 3.6 V (4)
- 1.72 V ~ 3.6 V (1)
- 1.8 V ~ 3.6 V (1)
- 1.8 V ~ 5.5 V (25)
- 1.8V (5)
- 2 V ~ 3.6 V (10)
- 2.3 V ~ 5.5 V (4)
- 2.4 V ~ 3.6 V (9)
- 2.7 V ~ 5.5 V (12)
- 3 V ~ 3.6 V (3)
- 3.3 V ~ 5 V (1)
- 3.6V (3)
- 4 V ~ 6 V (4)
- 4.5 V ~ 5.5 V (4)
- 5 V ~ 5.5 V (1)
- 5V (2)
- Supplier Device Package :
-
- 10-MLPD (3x3) (2)
- 10-WLCSP (1.59x1.25) (3)
- 10-WLCSP (1.65x1.48) (1)
- 12-UFDFPN (3x3) (5)
- 14-PDIP (1)
- 14-SO (3)
- 14-SOIC (2)
- 14-TSSOP (4)
- 16-QFN (3x3) (1)
- 16-QFN (4x4) (4)
- 16-SOIC (1)
- 16-TSSOP (3)
- 20-SSOP (1)
- 24-HVQFN (4x4) (2)
- 25-WLCSP (2.51x2.51) (2)
- 3-XSON (1x1.45) (6)
- 32-HVQFN (5x5) (1)
- 32-QFN (5x5) (1)
- 32-TQFN (5x5) (1)
- 32-VFQFPN-EP (5x5) (1)
- 36-QFN-EP (6x6) (2)
- 48-QFN (7x7) (1)
- 5-UFDFPN (1.7x1.4) (2)
- 6-XSON, SOT886 (1.45x1) (2)
- 64-HVQFN (9x9) (4)
- 64-QFN (9x9) (1)
- 8-MLP (2x3) (1)
- 8-SO (11)
- 8-TSSOP (12)
- 8-UFDFPN (2x3) (9)
- 8-XQFN (1.6x1.6) (1)
- Wafer (21)
- Interface :
- Standards :
-
- EPC (6)
- EPC, ISO 15693, ISO 18000-6 (2)
- EPC, ISO 18000-6 (2)
- ISO 11784, ISO 11785 (10)
- ISO 11784, ISO 11785, ISO 15693 (3)
- ISO 14443 (18)
- ISO 14443, ISO 15693 (1)
- ISO 14443, ISO 15693, ISO 18000-3 (4)
- ISO 14443, NFC (24)
- ISO 15693 (9)
- ISO 15693, ISO 18000-3 (16)
- ISO 15693, ISO 18000-3, NFC (9)
- ISO 15693, ISO 18000-6 (2)
- ISO 15693, NFC (7)
- ISO 18000-6 (1)
- ISO 18000-6, EPC (2)
- Minimum Quantity :
-
- 1 (7)
- 100 (1)
- 1000 (12)
- 10000 (1)
- 1003 (1)
- 12000 (2)
- 126524 (1)
- 1433 (1)
- 1500 (2)
- 15000 (10)
- 160000 (3)
- 166000 (1)
- 1799 (1)
- 190000 (3)
- 2000 (6)
- 206000 (4)
- 240000 (3)
- 2500 (15)
- 250000 (1)
- 2600 (1)
- 264696 (1)
- 2794 (1)
- 300 (1)
- 3000 (2)
- 33 (1)
- 3356 (1)
- 3876 (1)
- 4000 (14)
- 400000 (2)
- 423110 (4)
- 4409 (1)
- 4762 (1)
- 500 (2)
- 5000 (27)
- 6000 (2)
- 600000 (1)
- 6250 (1)
- 96000 (1)
- Applied Filters :
140 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Type | Package / Case | Series | Packaging | Frequency | Operating Temperature | Part Status | Voltage - Supply | Supplier Device Package | Interface | Standards | Factory Stock | Minimum Quantity | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
VIEW | NXP USA Inc. | NFC | - | 32-VFQFN Exposed Pad | Automotive, AEC-Q100 | - | - | -40°C ~ 85°C | Active | - | 32-HVQFN (5x5) | - | - | 0 | 6000 | ||||
|
VIEW | NXP USA Inc. | IC TEMP SENSOR NFC 25WLCSP | RFID Reader | 25-UFBGA, WLCSP | - | Tape & Reel (TR) | 13.56MHz | -40°C ~ 85°C | Active | 1.7 V ~ 3.6 V | 25-WLCSP (2.51x2.51) | I²C, SPI | ISO 14443 | 0 | 2000 | ||||
|
VIEW | NXP USA Inc. | TEMPERATURE LOGGER | RFID Reader/Transponder | Die | - | - | 13.56MHz | -40°C ~ 85°C | Active | 1.72 V ~ 3.6 V | Die | I²C | ISO 14443, NFC | 0 | 4409 | ||||
|
VIEW | NXP USA Inc. | IC TRANSPONDER RFID HITAG | RFID Transponder | Die | - | Bulk | 100kHz ~ 150kHz | -40°C ~ 85°C | Active | 4 V ~ 6 V | Wafer | - | ISO 11784, ISO 11785 | 0 | 423110 | ||||
|
VIEW | NXP USA Inc. | IC U-CODE RF FE DUAL DIFF 8XQFN | RFID Transponder | 8-XFQFN Exposed Pad | U-Code | Tape & Reel (TR) | 860MHz ~ 960MHz | -40°C ~ 85°C | Active | 1.8 V ~ 3.6 V | 8-XQFN (1.6x1.6) | I²C | ISO 18000-6 | 0 | 4000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE SLI UNCASED FOIL | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | Die | - | ISO 15693, ISO 18000-3 | 0 | 160000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE SLI 3XSON | RFID Transponder | 3-XDFN | I-Code | Tape & Reel (TR) | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | 3-XSON (1x1.45) | - | ISO 15693, ISO 18000-3 | 0 | 5000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE SLI UNCASED FOIL | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | - | - | ISO 15693, ISO 18000-3 | 0 | 190000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE SLI 3XSON | RFID Transponder | 3-XDFN | I-Code | Tape & Reel (TR) | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | 3-XSON (1x1.45) | - | ISO 15693, ISO 18000-3 | 0 | 5000 | ||||
|
VIEW | NXP USA Inc. | IC TRANSPONDER HITAG | RFID Transponder | Die | - | Bulk | 100kHz ~ 150kHz | -40°C ~ 85°C | Active | 4 V ~ 6 V | Wafer | - | ISO 11784, ISO 11785 | 0 | 400000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE SLI SOT1122 | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | - | - | ISO 15693, ISO 18000-3 | 0 | 160000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE SLI UNCASED FOIL | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | Die | - | ISO 15693, ISO 18000-3 | 0 | 160000 | ||||
|
VIEW | NXP USA Inc. | IC TRANSPONDER RFID HITAG | RFID Transponder | Die | - | Bulk | 100kHz ~ 150kHz | -40°C ~ 85°C | Active | 4 V ~ 6 V | Wafer | - | ISO 11784, ISO 11785 | 0 | 423110 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE SLI UNCASED FOIL | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | Die | - | ISO 15693, ISO 18000-3 | 0 | 190000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE SLI UNCASED FOIL | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | Die | - | ISO 15693, ISO 18000-3 | 0 | 190000 | ||||
|
VIEW | NXP USA Inc. | IC TRANSPONDER RFID HITAG | RFID Transponder | Die | - | Bulk | 100kHz ~ 150kHz | -40°C ~ 85°C | Active | 4 V ~ 6 V | Wafer | - | ISO 11784, ISO 11785 | 0 | 423110 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE ILT-M UNCASED WAFER | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | Wafer | - | ISO 15693, ISO 18000-3 | 0 | 96000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE ILT UNCASED WAFER | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | Wafer | - | ISO 15693, ISO 18000-3 | 0 | 166000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE ILT-M UNCASED WAFER | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | Wafer | - | ISO 15693, ISO 18000-3 | 0 | 206000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE ILT-M UNCASED WAFER | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | Wafer | - | ISO 15693, ISO 18000-3 | 0 | 206000 | ||||
|
VIEW | NXP USA Inc. | TRANSPONDER RFIC HITAG RO64 DIE | RFID Transponder | Die | HITAG™ | Bulk | 100kHz ~ 150kHz | -40°C ~ 85°C | Active | 5V | Die | - | - | 0 | 400000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE ILT UNCASED WAFER | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | Wafer | - | ISO 15693, ISO 18000-3 | 0 | 206000 | ||||
|
VIEW | NXP USA Inc. | IC I-CODE ILT UNCASED WAFER | RFID Transponder | Die | I-Code | Bulk | 13.56MHz | -40°C ~ 85°C | Active | 1.5 V ~ 1.7 V | Wafer | - | ISO 15693, ISO 18000-3 | 0 | 206000 | ||||
|
VIEW | NXP USA Inc. | TRANSPONDER RFIC HITAG RO64 DIE | RFID Transponder | Die | HITAG™ | Bulk | 100kHz ~ 150kHz | -40°C ~ 85°C | Active | 5V | Die | - | - | 0 | 423110 | ||||
|
VIEW | NXP USA Inc. | IC U-CODE G2IL+ DIE WAFER | RFID Transponder | Die | U-Code | Bulk | 840MHz ~ 960MHz | -40°C ~ 85°C | Active | 1.8V | Wafer | - | EPC | 0 | 240000 | ||||
|
VIEW | NXP USA Inc. | IC UCODE G2XL UNCASED FOIL | RFID Transponder | Die | U-Code | Bulk | 840MHz ~ 960MHz | -40°C ~ 85°C | Active | 1.8V | Die | - | EPC | 0 | 240000 | ||||
|
VIEW | NXP USA Inc. | IC U-CODE G2XL UNCASED WAFER | RFID Transponder | Die | U-Code | Bulk | 840MHz ~ 960MHz | -40°C ~ 85°C | Active | - | Die | - | ISO 15693, ISO 18000-6 | 0 | 600000 | ||||
|
VIEW | NXP USA Inc. | IC U-CODE G2IL DIE WAFER | RFID Transponder | Die | U-Code | Bulk | 840MHz ~ 960MHz | -40°C ~ 85°C | Active | 1.8V | Wafer | - | EPC | 0 | 240000 | ||||
|
VIEW | NXP USA Inc. | IC UCODE G2XL UNCASED FOIL | RFID Transponder | Die | U-Code | Bulk | 840MHz ~ 960MHz | -40°C ~ 85°C | Active | 1.8V | Die | - | EPC | 0 | 250000 | ||||
|
VIEW | NXP USA Inc. | UCODE 7 | RFID Transponder | Die | U-Code | - | 860MHz ~ 960MHz | -40°C ~ 85°C | Active | - | Wafer | - | EPC | 0 | 264696 |